IP Library › Assignment 030764/0849
Patent Assignment
Reel/Frame 030764/0849

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 3
Assignor
LIN, MOU-SHIUNG
Executed: 2005-11-01
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property (1)
Solder Interconnect on Ic Chip
Patent: 8,742,582 →
Application: 13/271,004 →
Publication: US 2012/0025378
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030771/0150 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →