IP Library › Assignment 030771/0150
Patent Assignment
Reel/Frame 030771/0150

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 4
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Properties (4)
Chip Structure
Patent: 7,964,973 →
Application: 12/202,342 →
Publication: US 2009/0108453
Over-Passivation Process of Forming Polymer Layer Over Ic Chip
Patent: 7,919,412 →
Application: 12/273,546 →
Publication: US 2009/0111261
Chip Structure
Patent: 8,159,074 →
Application: 13/098,379 →
Publication: US 2011/0204510
Solder Interconnect on Ic Chip
Patent: 8,742,582 →
Application: 13/271,004 →
Publication: US 2012/0025378
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 9, 2013
From: LIN, MOU-SHIUNG; CHOU, CHIU-MING; CHOU, CHIEN-KANG; LO, HSIN-JUNG
To: MEGIC CORPORATION
Reel/Frame 030761/0624 →
Assignment of Assignor's Interest Jul 10, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030764/0849 →
Assignment of Assignor's Interest Jul 10, 2013
From: LIN, MOU-SHIUNG; CHOU, CHIU-MING; CHOU, CHIEN-KANG; LO, HSIN-JUNG
To: MEGIC CORPORATION
Reel/Frame 030765/0931 →
Assignment of Assignor's Interest Jul 10, 2013
From: CHEN, YING-CHIH; CHOU, CHIU-MING; LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030766/0167 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →