Patent Assignment
Reel/Frame 030766/0167
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 3
Assignors
CHEN, YING-CHIH
Executed: 2005-06-15
CHOU, CHIU-MING
Executed: 2005-06-15
LIN, MOU-SHIUNG
Executed: 2005-06-15
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Over-Passivation Process of Forming Polymer Layer Over Ic Chip
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 10, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030771/0150 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →