IP Library Assignment 030766/0357
Patent Assignment
Reel/Frame 030766/0357

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 8
Assignor
TAMAR TECHNOLOGY
Executed: 2013-04-26
Assignee
RUDOLPH TECHNOLOGIES, INC.
ONE RUDOLPH ROAD, FLANDERS, NEW JERSEY, 07836
Covered Property (1)
Wafer shape thickness and trench measurement
Patent: 9,714,825 →
Application: 13/066,219 →
Publication: US 2012/0257207
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 13, 2013
From: MARX, DAVID; GRANT, DAVID
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 031001/0193 →
Assignment of Assignor's Interest Jul 2, 2020
From: RUDOLPH TECHNOLOGIES, INC.
To: ONTO INNOVATION INC.
Reel/Frame 053117/0623 →