Patent Assignment
Reel/Frame 053117/0623
Assignment of Assignor's Interest
Recorded: 2020-07-02
Pages: 84
Assignor
RUDOLPH TECHNOLOGIES, INC.
Executed: 2020-04-30
Assignee
ONTO INNOVATION INC.
16 JONSPIN ROAD, WILMINGTON, MASSACHUSETTS, 01887
Covered Properties
(112)
Imaging System
Patent:
6,407,810 →
Application:
09/522,540 →
System and Method for Locating Image Features
Patent:
6,744,913 →
Application:
09/551,106 →
System and Method for Locating Irregular Edges in Image Data
Patent:
6,459,807 →
Application:
09/592,641 →
System and Method for Inspecting Bumped Wafers
Patent:
6,765,666 →
Application:
09/631,509 →
Active-Matrix Liquid Crystal Display Apparatus and Method for Driving the Same and for Manufacturing the Same
Patent:
6,864,871 →
Application:
09/693,044 →
System and Method for Detecting Defects on a Structure-Bearing Surface Using Optical Inspection
Patent:
6,813,376 →
Application:
09/697,807 →
Optical Metrology System and Method Employing Laser-Server Supplying Laser Energy to Distributed Slave Metrology Heads
Method and Apparatus for Measuring Very Thin Dielectric Film Thickness and Creating a Stable Measurement Environment
System and Method for Analyzing Error Information from a Semiconductor Fabrication Process
Method and System for Reviewing a Semiconductor Wafer Using at Least One Defect Sampling Condition
Patent:
6,643,006 →
Application:
10/016,996 →
System and Method for Inspection Using Off-Angle Lighting
Patent:
7,024,031 →
Application:
10/035,592 →
Method and Apparatus for Decreasing Thermal Loading and Roughness Sensitivity in a Photoacoustic Film Thickness Measurement System
Method and Apparatus for Increasing Signal to Noise Ratio in a Photoacoustic Film Thickness Measurement System
Confocal 3D Inspection System and Process
Patent:
6,970,287 →
Application:
10/196,735 →
Confocal 3D Inspection System and Process
System and Method for Locating Irregular Edges in Image Data
Absolute Position Determination for a Ccd-Based Acquisition Unit
Automated Wafer Defect Inspection System Using Backside Illumination
Method and System for Analyzing Bitmap Test Data
System and Method for Multi-Wavelength, Narrow-Bandwidth Detection of Surface Defects
Patent:
6,847,443 →
Application:
10/322,582 →
Dual-Axis Scanning System and Method
Stereoscopic Three-Dimensional Metrology System and Method
Scalable, Automated Metrology System and Method of Making the System
System and Method for Inspection Using White Light Intererometry
Inspection Tool with a 3D Point Sensor to Develop a Focus Map
System and Method for Inspecting a Component Using Interferometry
Method of Applying the Analysis of Scrub Mark Morphology and Location to the Evaluation and Correction of Semiconductor Testing, Analysis, and Manufacture
System and Method of Mitigating Effects of Component Deflection in a Probe Card Analyzer
System and method of non-linear grid fitting and coordinate system mapping
System and Method of Point Matching Measured Positions to Template Positions
System and Method of Planar Positioning
System and Method of Measuring Probe Float
High Speed Lithography Machine and Method
Edge Normal Process
Product Setup Sharing for Multiple Inspection Systems
Edge Inspection
Camera and Illumination Matching for Inspection System
Photoresist Edge Bead Removal Measurement
Adjustable Film Frame Aligner
Measuring Elastic Moduli of Dielectric Thin Films Using an Optical Metrology System
Method of Performing Optical Measurement on a Sample
System for Generating Camera Triggers
Bitmap Cluster Analysis of Defects in Integrated Circuits
Dynamic Focusing Method and Apparatus
Method and System for Defect Detection
Trench Measurement System Employing a Chromatic Confocal Height Sensor and a Microscope
All Surface Data for Use in Substrate Inspection
Edge Normal Process
Metrology System with Spectroscopic Ellipsometer and Photoacoustic Measurements
Method of Applying the Analysis of Scrub Mark Morphology and Location to the Evaluation and Correction of Semiconductor Testing, Analysis, and Manufacture
Wafer Edge Inspection and Metrology
System and Method of Mitigating Effects of Component Deflection in a Probe Card Analyzer
Dynamic Focusing Method and Appartus
High-Speed Capacitor Leakage Measurement Systems and Methods
Photoresist Edge Bead Removal Measurement
Polarization Imaging
Analysis Techniques for Multi-Level Memory
Fiber Optic Darkfield Ring Light
Adjustable Film Frame Aligner
Stereoscopic Three-Dimensional Metrology System and Method
Metrology System with Spectroscopic Ellipsometer and Photoacoustic Measurements
Method and System for Providing a High Definition Triangulation System
Probe Card Analysis System and Method
Wafer Measurement System and Apparatus
Patent:
7,738,113 →
Application:
11/978,881 →
Edge Normal Process
Edge Inspection
An Apparatus for Obtaining Planarity Measurements with Respect to a Probe Card Analysis System
Semiconductor yield management system and method
Illuminator for Darkfield Inspection
Combination of Ellipsometry and Optical Stress Generation and Detection
Multiple Measurement Techniques Including Focused Beam Scatterometry for Characterization of Samples
Metrology System with Spectroscopic Ellipsometer and Photoacoustic Measurements
Characterization with Picosecond Ultrasonics of Metal Portions of Samples Potentially Subject to Erosion
Wafer Fabrication Monitoring Systems and Methods, Including Edge Bead Removal Processing
Apparatus for Obtaining Planarity Measurements with Respect to a Probe Card Analysis System
All Surface Data for Use in Substrate Inspection
Probe Mark Inspection
Wafer Edge Inspection and Metrology
Wafer Holding Mechanism
Bitmap Cluster Analysis of Defects in Integrated Circuits
Method of Applying the Analysis of Scrub Mark Morphology and Location to the Evaluation and Correction of Semiconductor Testing, Analysis, and Manufacture
System and Method for Estimating Field Curvature
System Metrology Core
Probe Card Analysis System and Method
Wafer Edge Inspection and Metrology
Wafer Edge Inspection
Wafer shape thickness and trench measurement
Inspection Device with Vertically Moveable Assembly
System for Directly Measuring the Depth of a High Aspect Ratio Etched Feature on a Wafer
Focusing Method and Apparatus
Polarization Imaging
Substrate Handler
Multiple Measurement Techniques Including Focused Beam Scatterometry for Characterization of Samples
Wafer Edge Inspection and Metrology
Selective Overtravel During Electrical Test of Probe Cards
Patent:
8,659,308 →
Application:
13/647,554 →
Scanning Operation with Concurrent Focus and Inspection
Wafer Inversion Mechanism
Scratch Detection Method and Apparatus
Support for Semiconductor Substrate
Wafer Edge Inspection Illumination System
High Speed Autofocus System
Position Sensitive Detection Optimization
System and Method of Characterizing Micro-Fabrication Processes
Substrate Handler
Method of Measuring and Assessing a Probe Card with an Inspection Device
On-Axis Focus Sensor and Method
Flying Sensor Head
Inspection of Substrates Using Calibration and Imaging
Planar Motor System With Increased Efficiency
Method and Apparatus to Assist the Processing of Deformed Substrates
Opto-Acoustic Metrology of Signal Attenuating Structures
Non-Destructive Acoustic Metrology for Void Detection
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 18, 2000
From: GUEST, CLYDE MAXWELL; THORNELL, JOHN MARK
To: SEMICONDUCTOR TECHNOLOGIES AND INSTRUMENTS
Reel/Frame 010755/0068 →
Change of Name
Jun 13, 2000
From: GUEST, CLYDE MAXWELL; CHANG, CHU-YIN
To: SEMICONDUCTOR TECHNOLOGIES AND INSTRUMENTS
Reel/Frame 010893/0795 →
Assignment of Assignor's Interest
Jul 31, 2000
From: REVEN, SHAWN; LIU, KUO-CHING
To: ROBOTIC VISION SYSTEMS, INC.
Reel/Frame 011018/0460 →
Assignment of Assignor's Interest
Aug 3, 2000
From: GUEST, CLYDE MAXWELL; ROY, RAJIV (NMI); HARRIS, CHARLES K.; WAHAWISAN, WEERAKIAT (NMI)
To: SEMICONDUCTOR TECHNOLOGIES AND INSTRUMENTS
Reel/Frame 011038/0551 →
Assignment of Assignor's Interest
Oct 20, 2000
From: OKADA, YOSHIHIRO; BAN, ATSUSHI; OKAMOTO, MASAYA
To: SHARP KABUSHIKI KAISHA
Reel/Frame 011384/0322 →
Assignment of Assignor's Interest
Jun 6, 2001
From: WOLF, R. GREGORY
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 011870/0051 →
Assignment of Assignor's Interest
Jul 9, 2001
From: KWON, DAEWON
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 011957/0591 →
Assignment of Assignor's Interest
Sep 14, 2001
From: BUCKHEIT, JONATHAN B.; WANG, WEIDONG
To: YIELD DYNAMICS, INC.
Reel/Frame 012172/0366 →
Assignment of Assignor's Interest
Dec 13, 2001
From: HSU, CHIN-JUNG; CHENG, ARNOLD; SONG, XIN
To: INSPEX, INC.
Reel/Frame 012386/0171 →
Assignment of Assignor's Interest
Mar 5, 2002
From: CASTELLANOS, RAMIRO NOLASCO; MATHUR, SANJEEV (NMI); THORNELL, JOHN MARK; CARRINGTON, THOMAS CASEY
To: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS, INC.
Reel/Frame 012659/0131 →
Assignment of Assignor's Interest
Mar 6, 2002
From: MORATH, CHRISTOPHER; VERTIKOV, ANDREY
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 012675/0839 →
Assignment of Assignor's Interest
Aug 21, 2002
From: GUEST, CLYDE MAXWELL; CHANG, CHU-YIN
To: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS, INC.
Reel/Frame 013220/0161 →
Assignment of Assignor's Interest
Aug 21, 2002
From: HENNESSEY, KATHLEEN; LIN, YOULING; LIU, YONGQIANG; KHAJA, VEERA V.S.
To: ISOA, INC.
Reel/Frame 013214/0156 →
Assignment of Assignor's Interest
Oct 9, 2002
From: STONER, ROBERT J.; MORATH, CHRISTOPHER
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 013369/0018 →
Assignment of Assignor's Interest
Oct 21, 2002
From: WATKINS, CORY; VAUGHNN, DAVID; BLAIR, ALAN
To: AUGUST TECHNOLOGY CORP.
Reel/Frame 013411/0662 →
Assignment of Assignor's Interest
Jan 28, 2003
From: SONG, XIN; HITELMAN, STEWART; HSU, CHIN-JUNG
To: INSPEX, INC.
Reel/Frame 013696/0991 →
Assignment of Assignor's Interest
Mar 11, 2003
From: HARLESS, MARK; JENUM, JEREMY; CAYMOND, WILLARD
To: AUGUST TECHNOLOGY CORPORATION
Reel/Frame 013832/0727 →
Assignment of Assignor's Interest
Apr 19, 2004
From: HARLESS, MARK; JENUM, JEREMY; RAYMOND, WILLARD
To: AUGUST TECHNOLOGY CORPORATION
Reel/Frame 015220/0725 →
Assignment of Assignor's Interest
Jan 12, 2006
From: ISOA INC.
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 017006/0328 →
Nunc Pro Tunc Assignment
Sep 21, 2006
From: ROBOTIC VISION SYSTEMS, INC., NOW KNOWN AS ACUITY CIMATRIX, INC.
To: RVSI INSPECTION LLC
Reel/Frame 018279/0776 →
Assignment of Assignor's Interest
Sep 5, 2008
From: YIELD DYNAMICS, INC.
To: MKS INSTRUMENTS, INC.
Reel/Frame 021489/0065 →
Assignment of Assignor's Interest
Oct 14, 2008
From: RVSI INSPECTION, LLC
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 021669/0907 →
Assignment of Assignor's Interest
Sep 3, 2010
From: MKS INSTRUMENTS, INC.
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 024946/0388 →
Assignment of Assignor's Interest
Jul 2, 2012
From: PALM, TROY; BARR, KEVIN J.; SOWDEN, RALPH P.; LABERGE, MATTHEW M.
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 028476/0753 →
Assignment of Assignor's Interest
Dec 6, 2012
From: WATKINS, CORY; VAUGHNN, DAVID
To: AUGUST TECHNOLOGY CORPORATION
Reel/Frame 029420/0619 →