System and method for multi-wavelength, narrow-bandwidth detection of surface defects
View Patent ↗A system and method for detecting defects in surface structures, such as those formed on semiconductor wafers. A light source, preferably a strobe light, provides illumination that is separated by a filter into a plurality of selected bandwidths. The light then is transported through a fiber optic cable to a diffuser, and from there directed toward the surface. A camera captures a plurality of images, each image formed by a separate portion of the electromagnetic spectrum. The images may be formed by either reflected or diffracted light, or both. The images may be stored or compared to an image of a calibration wafer.
1. A system for performing optical inspection of structures formed on a surface of a semiconductor wafer, said system comprising:
a light source for producing multiple narrow-band light spectra to illuminate the wafer surface; and
a camera for capturing at least one image produced by light emanating from the illuminated wafer surface;
wherein the camera is a multi-channel camera having a plurality of sensitivity peaks associated with different frequencies of light, and wherein the multiple narrow-band light spectra are chosen such that their central frequencies correspond with the camera sensitivity peaks.
2. The system of claim 1 , wherein the multiple narrow-band light spectra are produced by a multi-band filter.
3. A method for inspecting surface structure on a semiconductor wafer, said method comprising the steps of:
illuminating wafer surface using multiple narrow-band light spectra; and
capturing an image associated with each separate of the separate spectral;
wherein the capturing step is performed suing a multi-channel camera having a plurality of sensitivity peaks associated with different frequencies of light, and wherein the multiple narrow-band light spectra are chosen such that their central frequencies correspond with the camera sensitivity peaks.
4. A method of inspecting the surface of an object to detect defects, if any, in structures formed on the surface, said method comprising the steps of:
receiving the object in an inspection stand;
illuminating the object with light from narrow-band spectra selected from different portions of the electromagnetic spectrum;
capturing at least one image associated with each of the illuminating spectra;
wherein the capturing step is performed suing a multi-channel camera having a plurality of sensitivity peaks associated with different frequencies of light, and wherein the multiple narrow-band light spectra are chosen such that their central frequencies correspond with the camera sensitivity peaks.
5. The method of inspecting the surface of an object to detect defects of claim 4 , further comprising the steps of:
comparing the at least one captured image to the image of a calibrated object;
storing the captured image in a database;
displaying the at least one captured image; and
generating a color defect map.
6. The method of inspecting the surface of an object to detect defects of claim 5 , further comprising the steps of:
continuing the steps above for a plurality of wafers; and
building an image contrast map.