Probe card analysis system and method
View Patent ↗A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.
1. A system comprising:
a probe card comprising an array of probes;
an actuator mechanism operably coupled to the probe card to apply forces thereto independent of forces placed on the array of probes to emulate physical characteristics of a wafer test cell; and
a sensor measuring deflection of the probe card based on the applied forces.
2. The system of claim 1 , wherein the actuator mechanism is coupled to a probe card interface.
3. The system of claim 1 , wherein the actuator mechanism is coupled to a probe card analyzer module.
4. The system of claim 1 , wherein the actuator mechanism is configured to place forces on the probe array in pitch, roll and yaw directions.
5. The system of claim 1 , wherein the actuator mechanism is configured to alter a shape of the probe card.
6. The system of claim 1 , wherein the actuator mechanism is configured to alter a shape of a probe card analyzer module that engages tips of the probe card.
7. The system of claim 1 , wherein the sensor is coupled to a processor that models the applied forces to estimate a spring constant associated with the probe card.
8. A method for inspecting and analyzing wafer test probe arrays, said method comprising:
mounting a probe card having a probe array to an emulation system;
emulating forces on the probe card in the emulation system independent of forces placed on the probe array indicative of physical characteristics of a wafer test cell; and
measuring deflection of the probe card based on the emulated forces.
9. The method of claim 8 further comprising altering a shape of the probe card.
10. The method of claim 8 further comprising altering a shape of a probe card analyzer module engaging tips of the probe card.
11. The method of claim 8 , further comprising:
estimating a spring constant of the probe card based on the emulated forces.