All surface data for use in substrate inspection

1. A method of generating inspection data regarding at least a portion of a semiconductor wafer comprising:

capturing inspection data concerning at least two surfaces of the semiconductor wafer chosen from a top surface, an edge surface and a bottom surface of the semiconductor wafer;

calibrating the inspection data concerning the at least two surfaces of the semiconductor wafer such that a single coordinate system may define locations on the at least two surfaces of the semiconductor wafer;

forming a three-dimensional model of the wafer based on the captured inspection data; and

concatenating, using a controller, the inspection data including the three-dimensional model concerning the at least two surfaces of the semiconductor wafer into a single data structure and correlating defects occurring on at least two of the surfaces of the semiconductor wafer to identify semiconductor fabrication process problems.

2. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 1 further comprising:

capturing inspection data concerning substantially the entire surface of the semiconductor wafer;

calibrating the inspection data concerning substantially the entire surface of the semiconductor wafer such that a single coordinate system may define locations on substantially the entire surface of the semiconductor wafer; and

concatenating the inspection data concerning substantially the entire surface of the semiconductor wafer into a single data structure.

3. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 1 further comprising using spatial pattern recognition to correlate defects occurring on different surfaces of the semiconductor wafer.

4. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 1 wherein inspection data concerning substantially the entire area of each of the at least two surfaces is captured.

5. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 4 further comprising identifying defects on the at least two surfaces and using spatial pattern recognition to correlate defects occurring on different surfaces of the semiconductor wafer.

6. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 1 wherein inspection data concerning only a portion of the entire area of each of the at least two surfaces is captured.

7. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 6 further comprising identifying defects on the portion of the at least two surfaces and using spatial pattern recognition to correlate defects occurring on different surfaces of the semiconductor wafer.

8. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 1 further comprising generating a three dimensional model of the substrate from the captured inspection data.

9. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 1 wherein inspection data comprises data chosen from a list consisting of 2D metrology data, 3D metrology data, defect data, review image data, cross-references to review image data , defect classification data, crystallographic geometric and metrology data, deposited layer thickness metrology data, pixel brightness data, pixel color data, die classification data, die identification and location data, and die geometry data.

10. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 1 wherein the data structure comprises data sources chosen from a group consisting of text files, spreadsheets, HTML files, XML files, stand-alone databases and distributed databases.

11. A method of generating inspection data regarding at least a portion of a semiconductor wafer comprising:

capturing inspection data at varying levels of resolution concerning at least two surfaces of the semiconductor wafer chosen from a top surface, an edge surface and a bottom surface of the semiconductor wafer;

calibrating the inspection data concerning the at least two surfaces of the semiconductor wafer such that there exists at least one common referent shared amongst substantially all the inspection data on the at least two surfaces;

forming a three-dimensional model of the wafer based on the captured inspection data;

concatenating, using a controller, the inspection data including the three-dimensional model concerning the at least two surfaces of the semiconductor wafer into a single data structure; and

dynamically interacting with the three-dimensional model to view defect data concerning the wafer at the varying levels of resolution that is stored in the single data structure and which forms part of the three-dimensional model, the defect data including defects occurring on the at least two surfaces.

12. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 11 wherein the common referent is positional data.

13. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 11 further comprising classifying defects based on the data stored in the single data structure.

14. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 11 further comprising correlating data in the single data structure using spatial pattern recognition techniques.

15. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 11 further comprising controlling one or more inspection/metrology tool by manipulating data stored in the single data structure.

16. The method of generating inspection data regarding at least a portion of a semiconductor wafer of claim 11 wherein dynamically interacting with the three dimensional model comprises actions chosen from a group consisting of zooming in on the model, panning across the model, rotating the model, flipping the model, and displaying and removing multiple forms of inspection data.