Wafer inversion mechanism

1. A BOLTS compatible module comprising:

a BOLTS compatible housing; and

a support mechanism including opposing, first and second clamp arms within the housing, the support mechanism to grip a wafer, the support mechanism being coupled to a rotary mechanism including a rotary bearing to rotate the support mechanism with a wafer gripped therein, the rotary mechanism being coupled to the module and capable of at least 180° of rotation to invert a wafer gripped by the support mechanism.

2. The module of claim 1 , wherein the clamp arms include at least two gripping members, each gripping member including a pair of contact faces that work in conjunction with one another to grasp the wafer.

3. The module of claim 2 , wherein the contact faces are angled with respect to one another.

4. The module of claim 1 , further comprising a horizontal support configured to position the support mechanism relative to a vertical member.

5. The module of claim 1 , wherein the clamp arms include at least two gripping members carried by arm bodies of the clamp arms, each gripping member having a first portion and a second portion that reciprocate in a plane parallel to that of the clamp arms between an open position in which a wafer may be placed or removed and a closed position in which the first portion overlaps the second portion and the wafer is positively grasped.

6. The module of claim 1 , wherein the module is configured such that the rotary mechanism rotates the support mechanism about an axis of rotation parallel with a plane of a wafer gripped by the support mechanism.

7. The module of claim 1 , wherein the module is configured such that the rotary mechanism rotates the support mechanism about an axis of rotation that is parallel with a major plane of the first clamp arm and with a major plane of the second clamp arm.

8. The module of claim 1 , wherein the first and second clamp arms are fixed in parallel relation to one another.

9. The module of claim 1 , wherein the first clamp arm includes a first arm body and a first gripping member portion moveably coupled to the first arm body, and further wherein the second clamp arm includes a second arm body and a second gripping member portion moveably coupled to the second arm body, the first and second gripping member portions combining to define a gripping member configured to selectively grasp a wafer edge, and even further wherein the gripping member portions reciprocate relative to the corresponding arm body in a longitudinal direction of the corresponding arm body.

10. The module of claim 9 , wherein the first and second arm bodies are fixed relative to one another in a lateral direction that is perpendicular to the longitudinal direction.

11. The module of claim 10 , wherein the first and second arm bodies are Y-shaped.

12. The module of claim 1 , wherein the module is configured to be coupled to a wafer and substrate handling mechanism at a BOLTS interface of the wafer and substrate handling mechanism.

13. An edge grip mechanism comprising:

opposing, spaced apart, first and second arm bodies; and

at least two gripping members carried by the arm bodies, each gripping member having a first portion carried by the first arm body and a second portion carried by the second arm body, wherein the first portion is movable in a linear path relative to the first arm body and the second portion is moveable in a linear path relative to the second arm body, the portions reciprocating in a plane parallel to the arm bodies between an open position in which a substrate may be placed or removed and a closed position in which the first portion overlaps the corresponding second portion and the substrate is positively grasped;

each gripping member having a pair of contact faces that work in conjunction with one another to grasp the substrate.

14. The edge grip mechanism of claim 13 , wherein the edge grip mechanism is within a BOLTS compatible housing.

15. The edge grip mechanism claim 13 , wherein the contact faces are angled with respect to one another.

16. A method of handling a substrate, comprising:

positioning the substrate between two gripping members, each gripping member having a first portion and a second portion, the first portion moveably supported by a first arm body and the second portion moveably supported by second arm body, the first and second arm bodies arranged in an opposing, spaced apart fashion relative to one another;

reciprocating the first portion and the second portion of each of the two gripping members in a linear path and in a plane parallel with the arm bodies from an open position in which the substrate was positioned to a closed position in which the first portion and the second portion of each of the two gripping members overlap to positively grasp the substrate; and

rotating the substrate 180°.

17. The method of claim 16 , wherein positioning the wafer comprises positioning the wafer within a BOLTS compatible housing.