Edge inspection

1. A method for inspecting an edge of a semiconductor wafer, the method comprising:

placing a wafer in a semiconductor wafer inspection system;

activating brightfield illumination on a first edge of the wafer;

obtaining images of the first edge of the wafer for a first rotation of the wafer;

analyzing the images of the first edge of the wafer for the first rotation and using the results of the analysis to focus a camera;

deactivating the brightfield illumination;

activating darkfield illumination on the first edge of the wafer;

obtaining images of the first edge of the wafer for a second rotation of the wafer;

obtaining images of a second edge of the wafer for the second rotation of the wafer; and

analyzing the images of the first edge of the wafer for the first rotation, the images of the first edge of the wafer for the second rotation, and the images of the second edge of the wafer for the second rotation for wafer edge defects.

2. An edge inspection system comprising:

an illumination system comprising a diffuser positioned adjacent an edge of a wafer, the diffuser being constructed and arranged to illuminate substantially an entire bevel profile of the wafer edge;

an edge normal imager for capturing an image of substantially an entire bevel profile of the wafer edge; and

a processor for obtaining image data from the edge normal imager, the processor being constructed and arranged to identify defects in an image obtained from the edge normal camera.

3. The edge inspection system of claim 2 , further comprising an edge top camera for capturing an image of an edge bead removal exclusion zone of a wafer edge.