IP Library › Assignment 030768/0486
Patent Assignment
Reel/Frame 030768/0486

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2000-09-21
LEE, JIN-YUAN
Executed: 2000-09-21
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Properties (5)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,443,033 →
Application: 10/653,628 →
Publication: US 2004/0041211
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,405,150 →
Application: 11/273,071 →
Publication: US 2006/0068574
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,276,422 →
Application: 11/273,085 →
Publication: US 2006/0060973
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,265,047 →
Application: 11/273,105 →
Publication: US 2006/0076684
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,351,650 →
Application: 11/273,447 →
Publication: US 2006/0063374
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →