IP Library › Assignment 030770/0143
Patent Assignment
Reel/Frame 030770/0143

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 2
Assignors
WU, CHIH-WEI
Executed: 2013-07-04
LIN, JING-CHENG
Executed: 2013-07-04
LU, SZU WEI
Executed: 2013-07-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Die-On-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
Patent: 9,368,458 →
Application: 13/938,821 →
Publication: US 2015/0014844
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct the Second Inventors Name Previously Recorded at Reel: 030770 Frame: 0143. Assignor(S) Hereby Confirms the Assignment. Jun 5, 2020
From: WU, CHIH-WEI; LU, SZU-WEI; LIN, JING-CHENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052851/0887 →