IP Library Assignment 052851/0887
Patent Assignment
Reel/Frame 052851/0887

Corrective Assignment to Correct the Correct the Second Inventors Name Previously Recorded at Reel: 030770 Frame: 0143. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2020-06-05 Pages: 6
Assignors
WU, CHIH-WEI
Executed: 2020-05-18
LU, SZU-WEI
Executed: 2020-05-18
LIN, JING-CHENG
Executed: 2020-05-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Die-On-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
Patent: 9,368,458 →
Application: 13/938,821 →
Publication: US 2015/0014844
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2013
From: WU, CHIH-WEI; LIN, JING-CHENG; LU, SZU WEI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 030770/0143 →