Patent Assignment
Reel/Frame 052851/0887
Corrective Assignment to Correct the Correct the Second Inventors Name Previously Recorded at Reel: 030770 Frame: 0143. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2020-06-05
Pages: 6
Assignors
WU, CHIH-WEI
Executed: 2020-05-18
LU, SZU-WEI
Executed: 2020-05-18
LIN, JING-CHENG
Executed: 2020-05-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Die-On-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.