Patent Assignment
Reel/Frame 030774/0454
Assignment of Assignor's Interest
Recorded: 2013-07-05
Pages: 3
Assignee
MEIJI CO., LTD.
2-10, SHINSUNA 1-CHOME, KOTO-KU, TOKYO, 1368908, JAPAN
Covered Property
(1)
Packaged Solid Object And Method For Manufacturing Thereof