Patent Assignment
Reel/Frame 030774/0735
Assignment of Assignor's Interest
Recorded: 2013-07-11
Pages: 4
Assignor
NEC CORPORATION
Executed: 2013-06-21
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8666, JAPAN
Covered Properties
(3)
Semiconductor Device Capable of Reducing Interelectrode Leak Current and Manufacturing Method Thereof
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method for Manufacturing the Same
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 8, 2007
From: OHTAKE, HIROTO; INOUE, NAOYA; KUME, IPPEI; TODA, TAKESHI
To: NEC CORPORATION; NEC ELECTRONICS CORPORATION
Reel/Frame 019262/0700 →
Assignment of Assignor's Interest
Mar 24, 2008
From: TAGO, MASAMOTO; KURITA, YOICHIRO
To: NEC CORPORATION; NEC ELECTRONICS CORPORATION
Reel/Frame 020689/0265 →
Assignment of Assignor's Interest
May 21, 2009
From: KIKUCHI, KATSUMI; YAMAMICHI, SHINTARO; MURAI, HIDEYA; MAEDA, KATSUMI
To: NEC CORPORATION; NEC ELECTRONICS CORPORATION
Reel/Frame 022717/0600 →
Change of Name
Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0174 →
Change of Name
Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0423 →
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0869 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →