Patent Assignment
Reel/Frame 030774/0819
Assignment of Assignor's Interest
Recorded: 2013-07-11
Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2001-01-28
LIN, MOU-SHIUNG
Executed: 2001-01-28
HUANG, CHING-CHENG
Executed: 2001-01-28
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →