IP Library › Assignment 030774/0996
Patent Assignment
Reel/Frame 030774/0996

Assignment of Assignor's Interest

Recorded: 2013-07-11 Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2002-01-18
LEE, JIN-YUAN
Executed: 2002-01-18
HUANG, CHING-CHENG
Executed: 2002-01-18
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Properties (2)
Chip Package with Die and Substrate
Patent: 7,397,117 →
Application: 10/996,535 →
Publication: US 2005/0093113
Chip Package with Die and Substrate
Patent: 7,977,763 →
Application: 10/996,537 →
Publication: US 2005/0090099
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →