IP Library › Assignment 030778/0031
Patent Assignment
Reel/Frame 030778/0031

Assignment of Assignor's Interest

Recorded: 2013-07-11 Pages: 3
Assignors
KOREC, JACEK
Executed: 2013-07-03
YANG, BOYI
Executed: 2013-07-03
Assignee
IO SEMICONDUCTOR INC.
4350 EXECUTIVE DRIVE, SUITE 200, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Power Device Integration on a Common Substrate
Patent: 9,412,881 →
Application: 13/939,451 →
Publication: US US20140035047A1
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 8, 2014
From: IO SEMICONDUCTOR INC.
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 033501/0563 →
Assignment of Assignor's Interest Aug 24, 2015
From: SILANNA SEMICONDUCTOR U.S.A., INC.
To: SILANNA ASIA PTE LTD.
Reel/Frame 036422/0413 →
Termination and Release of Grant of Security Interest (Patents) Oct 7, 2015
From: HSBC BANK AUSTRALIA LIMITED ABN 48 006 434 162
To: SILANNA SEMICONDUCTOR U.S.A., INC. (FORMERLY KNOWN AS IO SEMICONDUCTOR)
Reel/Frame 036812/0429 →
Corrective Assignment to Correct the Erroneous Patent Number 9029901 to the Correct Patent No. 9029201 as Previously Recorded on Reel 036812 Frame 0429. Assignor(S) Hereby Confirms the Termination and Release of Grant of Security Interest Against All Patents Set Forth Herein. Oct 20, 2015
From: HSBC BANK AUSTRALIA LIMITED ABN 48 006 434 162
To: SILANNA SEMICONDUCTOR U.S.A., INC. (FORMERLY KNOWN AS IO SEMICONDUCTOR)
Reel/Frame 036907/0785 →