Patent Assignment
Reel/Frame 033501/0563
Change of Name
Recorded: 2014-08-08
Pages: 3
Assignor
IO SEMICONDUCTOR INC.
Executed: 2014-04-29
Assignee
SILANNA SEMICONDUCTOR U.S.A., INC.
4350 EXECUTIVE DRIVE, SUITE 200, SAN DIEGO, CALIFORNIA, 92121
Covered Properties
(4)
Power Device Integration on a Common Substrate
Power Device Integration on a Common Substrate
Power Device Integration on a Common Substrate
Power Device Integration on a Common Substrate
Patent:
8,674,440 →
Application:
13/939,422 →
Publication:
US US20140035032A1
PCT:
PCT/US2013/050700 ↗
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 11, 2013
From: KOREC, JACEK; YANG, BOYI
To: IO SEMICONDUCTOR INC.
Reel/Frame 030777/0540 →
Assignment of Assignor's Interest
Jul 11, 2013
From: KOREC, JACEK; YANG, BOYI
To: IO SEMICONDUCTOR INC.
Reel/Frame 030778/0051 →
Assignment of Assignor's Interest
Jul 11, 2013
From: KOREC, JACEK; YANG, BOYI
To: IO SEMICONDUCTOR INC.
Reel/Frame 030778/0031 →
Assignment of Assignor's Interest
Aug 24, 2015
From: SILANNA SEMICONDUCTOR U.S.A., INC.
To: SILANNA ASIA PTE LTD.
Reel/Frame 036422/0413 →
Termination and Release of Grant of Security Interest (Patents)
Oct 7, 2015
From: HSBC BANK AUSTRALIA LIMITED ABN 48 006 434 162
To: SILANNA SEMICONDUCTOR U.S.A., INC. (FORMERLY KNOWN AS IO SEMICONDUCTOR)
Reel/Frame 036812/0429 →
Corrective Assignment to Correct the Erroneous Patent Number 9029901 to the Correct Patent No. 9029201 as Previously Recorded on Reel 036812 Frame 0429. Assignor(S) Hereby Confirms the Termination and Release of Grant of Security Interest Against All Patents Set Forth Herein.
Oct 20, 2015
From: HSBC BANK AUSTRALIA LIMITED ABN 48 006 434 162
To: SILANNA SEMICONDUCTOR U.S.A., INC. (FORMERLY KNOWN AS IO SEMICONDUCTOR)
Reel/Frame 036907/0785 →