Patent Assignment
Reel/Frame 030778/0909
Assignment of Assignor's Interest
Recorded: 2013-07-11
Pages: 3
Assignors
LU, CHUN-LIN
Executed: 2013-05-03
CHEN, HSIEN-WEI
Executed: 2013-05-03
WU, KAI-CHIANG
Executed: 2013-05-03
KUO, HUNG-JUI
Executed: 2013-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods and Apparatus of Packaging Semiconductor Devices