Patent Assignment
Reel/Frame 030782/0649
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2001-10-22
LEI, MING-TA
Executed: 2001-10-22
LEE, JIN-YUAN
Executed: 2001-10-22
HUANG, CHING-CHENG
Executed: 2001-10-22
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Post Passivation Metal Scheme for High-Performacne Integrated Circuit Devices
Patent:
6,649,509 →
Application:
09/998,862 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →