IP Library Assignment 030793/0816
Patent Assignment
Reel/Frame 030793/0816

Assignment of Assignor's Interest

Recorded: 2013-07-12 Pages: 5
Assignors
SHI, LEI
Executed: 2013-06-24
GAO, GUOHUA
Executed: 2013-06-24
TAO, YUJUAN
Executed: 2013-06-24
MASUDA, NAOMI
Executed: 2013-06-24
MEGURO, KOICHI
Executed: 2013-06-24
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288 CHONGCHUAN ROAD,, CHONGCHUAN DISTRICT, NANTONG, JIANGSU, 226006, CHINA
Covered Property (1)
Method for Chip Packaging
Patent: 8,883,627 →
Application: 13/883,231 →
Publication: US 2013/0280904
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 17, 2017
From: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
To: TONGFU MICROELECTRONICS CO., LTD.
Reel/Frame 041381/0374 →