Patent Assignment
Reel/Frame 041381/0374
Change of Name
Recorded: 2017-01-17
Pages: 8
Assignor
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Executed: 2016-12-01
Assignee
TONGFU MICROELECTRONICS CO., LTD.
NO. 288, CHONGCHUAN ROAD,, NANTONG, 226006, CHINA
Covered Properties
(29)
Method for Chip Packaging
Method for Chip Package
Packaging Method
Packaging Structure
3D System-Level Packaging Methods and Structures
Fan-Out High-Density Packaging Methods and Structures
System-Level Packaging Methods and Structures
Three-Dimensional System-Level Packaging Methods and Structures
Semiconductor Ic Packaging Methods and Structures
Semiconductor Packaging Structure and Method for Forming the Same
Semiconductor Packaging Structure and Method
Semiconductor Device and Fabrication Method
Metal Contact for Semiconductor Device
Metal Contact for Chip Packaging Structure
Package Structure
Method for Forming Package Structure
Semiconductor Packaging Structure And Forming Method Therefor
Flip-Chip on Leadframe Semiconductor Packaging Structure and Fabrication Method Thereof
Testing Probe and Semiconductor Testing Fixture, and Fabrication Methods Thereof
Testing Probe and Semiconductor Testing Fixture, and Fabrication Methods Thereof
Testing Probe, Semiconductor Testing Fixture and Fabrication Method Thereof
Semiconductor Testing Fixture and Fabrication Method Thereof
Semiconductor Testing Fixture and Fabrication Method Thereof
Method and Structure for Wafer-Level Packaging
Substrate with a Supporting Plate and Fabrication Method Thereof
Application:
14/967,986 →
Publication:
US 2016/0172313
Method and Structure for Wafer-Level Packaging
Method and Structure for Fan-Out Wafer Level Packaging
Application:
14/975,894 →
Publication:
US 2016/0189983
Method and Structure for Fan-Out Wafer Level Packaging
Application:
14/975,895 →
Publication:
US 2016/0190028
Structure and Method of Reinforcing a Conductor Soldering Point of Semiconductor Device
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2013
From: SHI, LEI; TAO, YUJUAN; GAO, GUOHUA; MASUDA, NAOMI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 030346/0007 →
Assignment of Assignor's Interest
Jul 12, 2013
From: SHI, LEI; GAO, GUOHUA; TAO, YUJUAN; MASUDA, NAOMI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 030793/0816 →
Assignment of Assignor's Interest
Jul 23, 2013
From: TAO, YUJUAN; SHI, LEI; GAO, GUOHUA; SHI, JIANGEN
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 030856/0807 →
Assignment of Assignor's Interest
Jul 23, 2013
From: TAO, YUJUAN; SHI, LEI; GAO, GUOHUA; YANG, GUOJI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 030856/0746 →
Assignment of Assignor's Interest
Aug 12, 2013
From: TAO, YUJUAN; SHI, LEI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031003/0554 →
Assignment of Assignor's Interest
Aug 12, 2013
From: TAO, YUJUAN; SHI, LEI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031003/0582 →
Assignment of Assignor's Interest
Aug 12, 2013
From: TAO, YUJUAN; SHI, LEI; WANG, HONGHUI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031003/0672 →
Assignment of Assignor's Interest
Aug 12, 2013
From: TAO, YUJUAN; SHI, LEI; WANG, HONGHUI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031003/0797 →
Assignment of Assignor's Interest
Nov 7, 2013
From: LIN, CHANG-MING; SHI, LEI; WU, XIAO-CHUN
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031599/0592 →
Assignment of Assignor's Interest
Nov 7, 2013
From: LIN, CHANG-MING; TAO, YU-JUAN
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031599/0689 →
Assignment of Assignor's Interest
Nov 7, 2013
From: LIN, CHANG-MING; SHI, LEI; GAO, GUO-HUA
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031599/0712 →
Assignment of Assignor's Interest
Nov 7, 2013
From: LIN, CHANG-MING; TAO, YU-JUAN
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 031599/0665 →
Assignment of Assignor's Interest
May 5, 2015
From: LIN, CHANG-MING; SHI, LEI; WANG, HONGHUI
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 035570/0461 →
Assignment of Assignor's Interest
May 7, 2015
From: LIN, CHANG-MING; SHI, LEI; SHEN, HAIJUN
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 035590/0548 →
Assignment of Assignor's Interest
Jul 23, 2015
From: TAO, YUJUAN
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 036161/0220 →
Assignment of Assignor's Interest
Aug 7, 2015
From: TAO, YUJUAN
To: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Reel/Frame 036277/0550 →
Assignment of Assignor's Interest
Oct 5, 2015
From: XIA, XIN; DING, WANCHUNG; GAO, GUOHUA
To: NANTONG FUJITSU MICROELECTRONICS., LTD.
Reel/Frame 036729/0301 →