IP Library › Assignment 031599/0592
Patent Assignment
Reel/Frame 031599/0592

Assignment of Assignor's Interest

Recorded: 2013-11-07 Pages: 3
Assignors
LIN, CHANG-MING
Executed: 2013-11-06
SHI, LEI
Executed: 2013-11-06
WU, XIAO-CHUN
Executed: 2013-11-06
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288, CHONGCHUAN ROAD,, NANTONG, 226006, CHINA
Covered Property (1)
Semiconductor Ic Packaging Methods and Structures
Patent: 9,589,815 →
Application: 14/074,598 →
Publication: US 2014/0124927
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 17, 2017
From: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
To: TONGFU MICROELECTRONICS CO., LTD.
Reel/Frame 041381/0374 →