Patent Assignment
Reel/Frame 031003/0582
Assignment of Assignor's Interest
Recorded: 2013-08-12
Pages: 3
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288, CHONGCHUAN ROAD, NANTONG, 226006, CHINA
Covered Property
(1)
Fan-Out High-Density Packaging Methods and Structures
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.