IP Library › Assignment 036729/0301
Patent Assignment
Reel/Frame 036729/0301

Assignment of Assignor's Interest

Recorded: 2015-10-05 Pages: 8
Assignors
XIA, XIN
Executed: 2015-09-17
DING, WANCHUNG
Executed: 2015-09-17
GAO, GUOHUA
Executed: 2015-09-17
Assignee
NANTONG FUJITSU MICROELECTRONICS., LTD.
NO. 288, CHONGCHUAN ROAD, CHONGCHUAN DISTRICT, NANTONG, JIANGSU, 226006, CHINA
Covered Property (1)
Semiconductor Packaging Structure And Forming Method Therefor
Patent: 9,515,010 →
Application: 14/780,233 →
Publication: US 2016/0043020
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 17, 2017
From: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
To: TONGFU MICROELECTRONICS CO., LTD.
Reel/Frame 041381/0374 →