IP Library › Assignment 030346/0007
Patent Assignment
Reel/Frame 030346/0007

Assignment of Assignor's Interest

Recorded: 2013-05-03 Pages: 5
Assignors
SHI, LEI
Executed: 2013-04-28
TAO, YUJUAN
Executed: 2013-04-28
GAO, GUOHUA
Executed: 2013-04-28
MASUDA, NAOMI
Executed: 2013-04-28
MEGURO, KOICHI
Executed: 2013-04-28
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288 CHONGCHUAN ROAD, CHONGCHUAN DISTRICT, NANTONG, JIANGSU, 226006, CHINA
Covered Property (1)
Method for Chip Package
Patent: 9,362,173 →
Application: 13/883,399 →
Publication: US 2013/0224910
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 17, 2017
From: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
To: TONGFU MICROELECTRONICS CO., LTD.
Reel/Frame 041381/0374 →