Testing probe and semiconductor testing fixture, and fabrication methods thereof

1. A testing probe for a semiconductor testing fixture, comprising:

an insulating body having a chamber configured through the insulating body;

a first testing pin disposed inside the chamber of the insulating body, and including: a first testing terminal on one end of the first testing pin and a first connection terminal on another end of the first testing pin;

an elastic member disposed inside the chamber and attached to the first testing pin to drive an upward or downward movement of the first testing pin along the chamber; and

a second testing pin disposed around an outer sidewall surface of the insulating body enclosing the first testing pin, and including: a second testing terminal on one end of the second testing pin and a second connection terminal on another end of the second testing pin, wherein:

the first testing terminal has a flat surface;

the top surface of the insulating body is lower than the flat surface of the first testing terminal; and

the second testing terminal has a concave first curve surface including: a center edge contacting an edge of the insulating body and a peripheral edge contacting a top surface of the second testing pin.

2. The testing probe of claim 1 , wherein the chamber in the insulating body includes:

a first chamber section;

a second chamber section connecting to an upper end of the first chamber section; and

a third chamber section connecting to a lower end of the first chamber section, wherein:

the second and third chamber sections have a diameter smaller than a diameter of the first chamber section;

the first testing pin penetrates through the first, second, and third chamber sections; and

the elastic member is disposed at least in the first chamber section.

3. The testing probe of claim 2 , wherein:

the first testing pin has a stopper protrusion protruded from a first body of the first testing pin to restrain the first testing pin inside the first chamber section, wherein the first testing terminal and the first connection terminal are configured on ends of the first body; and

the elastic member has one end pressing against the stopper protrusion and another end pressing against a bottom wall of the first chamber section.

4. The testing probe of claim 3 , wherein:

the elastic member includes a spring;

the first testing pin passes through a hollow structure in a middle of the spring; and

the spring has one end pressing against the stopper protrusion and another end pressing against the bottom wall of the first chamber section.

5. The testing probe of claim 3 , wherein:

the elastic member includes one or more metal spring plates; and

the metal spring plate has one end pressing against the stopper protrusion and another end pressing against the bottom wall of the first chamber section.

6. The testing probe of claim 1 , wherein:

the first testing terminal has a concave second curve surface; and

the top surface of the insulating body has a concave curve surface connecting the first curve surface and the second curve surface when the testing probe engages with a spherical, ellipsoidal or nearly spherical test terminal.

7. The testing probe of claim 6 , wherein:

the first curve surface and the second curve surface approximate a curvature of the spherical, ellipsoidal or nearly spherical test terminal.

8. A semiconductor testing fixture, comprising:

a plurality of testing probes according to the testing probe of claim 1 and a substrate,

wherein the plurality of testing probes is configured on the substrate.

9. A semiconductor testing fixture, comprising:

a substrate;

a plurality of the testing probes configured on the substrate,

wherein each testing probe includes:

an insulating body having a chamber configured through the insulating body;

a first testing pin disposed inside the chamber of the insulating body, and including: a first testing terminal on one end of the first testing pin and a first connection terminal on another end of the first testing pin;

an elastic member disposed inside the chamber and attached to the first testing pin to drive an upward or downward movement of the first testing pin along the chamber; and

a second testing pin disposed around an outer sidewall surface of the insulating body enclosing the first testing pin, and including: a second testing terminal on one end of the second testing pin and a second connection terminal on another end of the second testing pin, wherein:

the first testing terminal has a flat surface;

the top surface of the insulating body is lower than the flat surface of the first testing terminal; and

the second testing terminal has a concave first curve surface including: a center edge contacting an edge of the insulating body and a peripheral edge contacting a top surface of the second testing pin; and

an inspection unit electrically connected to either the first connection terminal of the first testing pin or the second connection terminal of the second testing pin and configured to determine whether the testing probe has a contact with the first connection terminal or the second connection terminal during an electrical characteristics testing.

10. The semiconductor testing fixture of claim 9 , wherein:

the inspection unit includes a first electrode and a second electrode; and

the inspection unit is a light emitting diode (LED) or a visual indicator.

11. The semiconductor testing fixture of claim 10 , wherein:

the first electrode of the inspection unit is electrically connected to either the first connection terminal of the first testing pin or the second connection terminal of the second testing pin; and

the second electrode of the inspection unit is electrically connected to an external test circuit.

12. The semiconductor testing fixture of claim 11 , wherein:

a signal transmission circuit formed in the substrate includes a first input terminal, a first output terminal, a second input terminal, and a second output terminal;

when the first electrode of the inspection unit is electrically connected to the first connection terminal of the first testing pin, the first output terminal is electrically connected to the second electrode of the inspection unit, the second output terminal is electrically connected to the second connection terminal of the second testing pin, and the first input terminal and the second input terminal are electrically connected to the external test circuit respectively; and

when the first electrode of the inspection unit is electrically connected to the second connection terminal of the second testing pin, the first output terminal is electrically connected to the first connection terminal of the first testing pin, the second output terminal is electrically connected to the second electrode of the inspection unit, and the first input terminal and the second input terminal are electrically connected to the external test circuit respectively.

13. A method for forming a testing probe for a semiconductor testing fixture, comprising:

providing an insulating body having a chamber through the insulating body;

configuring a first testing pin inside the chamber of the insulating body, the first testing pin including: a first testing terminal on one end of the first testing pin and a first connection terminal on another end of the first testing pin;

configuring an elastic member inside the chamber and attached to the first testing pin to drive an upward or downward movement of the first testing pin along the chamber; and

configuring a second testing pin around an outer sidewall surface of the insulating body enclosing the first testing pin, the second testing pin including: a second testing terminal on one end of the second testing pin and a second connection terminal on another end of the second testing pin, wherein:

the first testing terminal has a flat surface;

the top surface of the insulating body is lower than the flat surface of the first testing terminal; and

the second testing terminal has a concave first curve surface including: a center edge contacting an edge of the insulating body and a peripheral edge contacting a top surface of the second testing pin.

14. The method of claim 13 , wherein the chamber in the insulating body includes:

a first chamber section;

a second chamber section connecting to an upper end of the first chamber section; and

a third chamber section connecting to a lower end of the first chamber section, wherein:

the second and third chamber sections have a diameter smaller than a diameter of the first chamber section;

the first testing pin penetrates through the first, second, and third chamber sections; and

the elastic member is disposed at least in the first chamber section.

15. The method of claim 14 , wherein:

the first testing pin has a stopper protrusion protruded from a first body of the first testing pin to restrain the first testing pin inside the first chamber section, wherein the first testing terminal and the first connection terminal are configured on ends of the first body; and

the elastic member has one end pressing against the stopper protrusion and another end pressing against a bottom wall of the first chamber section.

16. The method of claim 13 , wherein:

the first testing terminal has a concave second curve surface; and

the top surface of the insulating body has a concave curve surface connecting the first curve surface and the second curve surface when the testing probe engages with a spherical, ellipsoidal or nearly spherical test terminal.

17. The method of claim 16 , wherein:

the first curve surface and the second curve surface approximate a curvature of the spherical, ellipsoidal or nearly spherical test terminal.

18. The method of claim 13 , further including:

configuring a plurality of testing probes on a substrate.