IP Library › Assignment 035590/0548
Patent Assignment
Reel/Frame 035590/0548

Assignment of Assignor's Interest

Recorded: 2015-05-07 Pages: 4
Assignors
LIN, CHANG-MING
Executed: 2015-04-23
SHI, LEI
Executed: 2015-04-23
SHEN, HAIJUN
Executed: 2015-04-23
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288 CHONGCHUAN ROAD, CHONGCHUAN DISTRICT, NANTONG, JIANGSU, 226006, CHINA
Covered Property (1)
Metal Contact for Chip Packaging Structure
Patent: 9,293,432 →
Application: 14/441,477 →
Publication: US 2015/0294949
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 17, 2017
From: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
To: TONGFU MICROELECTRONICS CO., LTD.
Reel/Frame 041381/0374 →