Semiconductor testing fixture and fabrication method thereof
A semiconductor testing fixture is provided. The semiconductor testing fixture comprises a substrate having a surface; a plurality of testing probes formed on the surface of the substrate; and a dielectric layer filling space between adjacent testing probes and covering side surfaces of the plurality of testing probes formed on the surface of the substrate.
1. A semiconductor testing fixture, comprising:
a substrate having a surface;
a plurality of testing probes formed on the surface of the substrate, each of the plurality of testing probes comprising a first testing tip, an insulation layer formed on a side surface of the first testing tip, and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on side surface of the insulation layer; and
a dielectric layer filling a space between two adjacent testing probes of the plurality of testing probes and covering side surfaces of the plurality of the testing probes formed on the surface of the substrate,
wherein a top surface of the dielectric layer levels with a top surface of the plurality of testing probes, and an end surface of the insulation layer levels with an end surface of the first testing tip and an end surface of the second testing tip.
2. The semiconductor testing fixture according to claim 1 , wherein the substrate further comprises:
a signal transmitting circuit including a plurality of first output terminals electrically connected with the first testing tips, a plurality of second output terminals electrically connected with the second testing tips, and a plurality of first input terminals and a plurality of second input terminals electrically connected with an external testing circuit.
3. The semiconductor testing fixture according to claim 1 , wherein the substrate further comprises:
a transmitting circuit having a plurality of output terminals electrically connected with the testing probes, and a plurality of input terminals electrically connected with an external testing circuit.
4. The semiconductor testing fixture according to claim 1 , wherein:
the dielectric layer covers portions of side surfaces of the plurality of testing probes.
5. The semiconductor testing fixture according to claim 4 , wherein:
a thickness of the dielectric layer is approximately ¼ to ⅔ of a height of the testing probes.
6. The semiconductor testing structure according to claim 1 , wherein the dielectric layer covers entire side surfaces of the plurality of testing probes.
7. The semiconductor testing fixture according to claim 6 , further comprising:
a transition board formed on a top surface of the dielectric layer and top surfaces of the plurality of testing probes.
8. A method for fabricating a semiconductor testing fixture, comprising:
providing a substrate having a surface;
forming a plurality of testing probes on the surface of the substrate, each of the plurality of testing probes comprising a first testing tip, an insulation layer formed on a side surface of the first testing tip, and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on side surface of the insulation layer; and
forming a dielectric layer electrically insulating two adjacent testing probes of the plurality of testing probes on the surface of the substrate,
wherein a top surface of the dielectric layer levels with a top surface of the plurality of testing probes, and an end surface of the insulation layer levels with an end surface of the first testing tip and an end surface of the second testing tip.
9. The method according to claim 8 , wherein:
the dielectric layer covers entire side surfaces of the testing probes.
10. The method according to claim 9 , further comprising:
forming a transition board on a top surface of the dielectric layer and top surfaces of the testing probes.
11. The method according to claim 8 , wherein forming the plurality of testing probes further comprises:
forming a plurality of the first testing tips on the surface of the substrate;
forming the insulation layer on side surfaces of the first testing tips; and
forming the second testing tip on the insulation layer around each of the plurality of first testing tips.
12. A method for fabricating a semiconductor testing fixture, comprising:
providing a substrate having a surface;
forming a dielectric layer on the surface of the substrate; and
forming a plurality of testing probes in the dielectric layer, each of the plurality of testing probes comprising a first testing tip, an insulation layer formed on a side surface of the first testing tip, and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on side surface of the insulation layer,
wherein a top surface of the dielectric layer levels with a top surface of the plurality of testing probes, and an end surface of the insulation layer levels with an end surface of the first testing tip and an end surface of the second testing tip.
13. The method according to claim 12 , wherein forming the plurality of testing probes further comprises:
forming a plurality of first through-holes and a plurality of ring-shaped through-holes being coaxial with the first through-holes and surrounding the first through-holes in the dielectric layer; and
forming a first testing tip in each of the plurality of first through-holes and a second testing tip in each of the plurality of ring-shaped through-holes.
14. The method according to claim 12 , after forming the plurality of testing probes further including:
forming a transition board on a top surface of the dielectric layer and top surfaces of the plurality of testing probes when the dielectric layer covers entire side surfaces of the testing probes.