IP Library Assignment 030811/0050
Patent Assignment
Reel/Frame 030811/0050

Assignment of Assignor's Interest

Recorded: 2013-07-16 Pages: 3
Assignors
TEH, WENG HONG
Executed: 2012-02-13
KULKARNI, DEEPAK V.
Executed: 2012-02-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Bbul Material Integration in-Plane with Embedded Die for Warpage Control
Patent: 9,601,421 →
Application: 13/976,356 →
Publication: US 2014/0217599
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →