Patent Assignment
Reel/Frame 030817/0670
Assignment of Assignor's Interest
Recorded: 2013-07-17
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same