Patent Assignment
Reel/Frame 030818/0365
Assignment of Assignor's Interest
Recorded: 2013-07-17
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2013-07-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Forming Package Structure