Patent Assignment
Reel/Frame 030835/0377
Assignment of Assignor's Interest
Recorded: 2013-07-19
Pages: 7
Assignors
WATANABE, TAKESHI
Executed: 2013-07-11
ISHII, JUNYA
Executed: 2013-07-11
SAITOU, HIROFUMI
Executed: 2013-07-11
KITAJIMA, HIROYASU
Executed: 2013-07-11
KOJIMA, TATSUKI
Executed: 2013-07-11
KAWASHIMA, YOSHITSUGU
Executed: 2013-07-11
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having Crack-Resisting Ring Structure and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.