Patent Assignment
Reel/Frame 030837/0397
Assignment of Assignor's Interest
Recorded: 2013-07-19
Pages: 2
Assignors
LIOU, JOUNG-WEI
Executed: 2013-07-11
HSIAW, HAN-TI
Executed: 2013-07-11
LIN, KENG-CHU
Executed: 2013-07-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Hard Mask for Back-End-of-Line (Beol) Interconnect Structure