Patent Assignment
Reel/Frame 030864/0199
Assignment of Assignor's Interest
Recorded: 2013-07-12
Pages: 4
Assignors
LIN, CHIEN-TING
Executed: 2013-07-08
TSAI, SHIH-HUNG
Executed: 2013-07-08
LIN, CHUN-HSIEN
Executed: 2013-07-08
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Method of Forming Shallow Trench Isolation Structure