Patent Assignment
Reel/Frame 030864/0694
Assignment of Assignor's Interest
Recorded: 2013-07-18
Pages: 5
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2009-12-23
Assignee
ROUND ROCK RESEARCH, LLC
101 HUDSON STREET, SUITE 2100, JERSEY CITY, NEW JERSEY, USA 07302
Covered Property
(1)
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices and Package Assemblies Therefor