Patent Assignment
Reel/Frame 030877/0884
Assignment of Assignor's Interest
Recorded: 2013-07-25
Pages: 4
Assignors
CHEN, SHENG-CHAU
Executed: 2013-07-18
HUANG, CHIH-HUI
Executed: 2013-07-18
TU, YEUR-LUEN
Executed: 2013-07-18
WU, CHENG-TA
Executed: 2013-07-18
TSAI, CHIA-SHIUNG
Executed: 2013-07-18
CHEN, XIAO-MENG
Executed: 2013-07-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6,SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Cleaning Substrate Surface for Hybrid Bonding