Patent Assignment
Reel/Frame 030886/0155
Assignment of Assignor's Interest
Recorded: 2013-07-26
Pages: 7
Assignors
YOON, JUNHO
Executed: 2013-06-10
KIM, DONGCHAN
Executed: 2013-06-13
MIN, GYUNGJIN
Executed: 2013-06-13
PARK, JAEHONG
Executed: 2013-06-13
JANG, YONGMOON
Executed: 2013-06-13
HAN, JE-WOO
Executed: 2013-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating a Semiconductor Device with Capacitors Using Mold Structure and Protection Layer