Patent Assignment
Reel/Frame 030899/0642
Assignment of Assignor's Interest
Recorded: 2013-07-30
Pages: 3
Assignor
OKADA, YUYA
Executed: 2013-05-13
Assignee
CANON KABUSHIKI KAISHA
30-2, SHIMOMARUKO 3-CHOME, OHTA-KU, TOKYO, 146-8501, JAPAN
Covered Property
(1)
Multilayered Semiconductor Device, Printed Circuit Board, and Method of Manufacturing Multilayered Semiconductor Device