Patent Assignment
Reel/Frame 030904/0025
Assignment of Assignor's Interest
Recorded: 2013-07-30
Pages: 4
Assignors
YAMAWAKU, JUN
Executed: 2013-07-22
KOSHIMIZU, CHISHIO
Executed: 2013-07-22
MATSUDO, TATSUO
Executed: 2013-07-22
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method of Measuring Temperature of Component in Processing Chamber of Substrate Processing Apparatus