Patent Assignment
Reel/Frame 030912/0790
Assignment of Assignor's Interest
Recorded: 2013-07-31
Pages: 7
Assignors
ZHANG, XIAOTIAN
Executed: 2013-07-25
PAN, HUA
Executed: 2013-07-12
LU, MING-CHEN
Executed: 2013-07-12
LU, JUN
Executed: 2013-07-24
YILMAZ, HAMZA
Executed: 2013-07-18
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY,, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Stacked Multi - Chip Packaging Structure and Manufacturing Method Thereof