Patent Assignment
Reel/Frame 030915/0768
Assignment of Assignor's Interest
Recorded: 2013-07-31
Pages: 5
Assignors
LIN, YUNG-CHI
Executed: 2013-07-12
CHEN, HSIN-YU
Executed: 2013-07-12
CHUNG, MING-TSU
Executed: 2013-07-12
LO, HSIAOYUN
Executed: 2013-07-12
SHIH, HONG-YE
Executed: 2013-07-12
CHEN, CHIA-YIN
Executed: 2013-07-12
YANG, KU-FENG
Executed: 2013-07-12
WU, TSANG-JIUH
Executed: 2013-07-12
CHIOU, WEN-CHIH
Executed: 2013-07-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Having Backside Interconnect Structure on Through Substrate via and Method of Forming the Same