Patent Assignment
Reel/Frame 030931/0870
Assignment of Assignor's Interest
Recorded: 2013-08-02
Pages: 3
Assignors
HUNG, WENSEN
Executed: 2013-07-29
HUANG, SZU-PO
Executed: 2013-07-29
CHEN, KIM HONG
Executed: 2013-07-29
JENG, SHIN-PUU
Executed: 2013-07-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3DIC Packages with Heat Dissipation Structures