Patent Assignment
Reel/Frame 030937/0983
Assignment of Assignor's Interest
Recorded: 2013-08-03
Pages: 3
Assignors
HOU, SHANG-YUN
Executed: 2013-03-19
YEH, DER-CHYANG
Executed: 2013-03-19
JENG, SHIN-PUU
Executed: 2013-03-19
YU, CHEN-HUA
Executed: 2013-03-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Structure and Method for 3D Ic Package