Patent Assignment
Reel/Frame 030948/0928
Assignment of Assignor's Interest
Recorded: 2013-08-06
Pages: 4
Assignors
LIN, YEONG-JYH
Executed: 2013-07-12
LIAO, HSIN-HUNG
Executed: 2013-07-12
HWANG, CHIEN-LING
Executed: 2013-07-12
JANG, BOR-PING
Executed: 2013-07-12
LIANG, HSIAO-CHUNG
Executed: 2013-07-12
LIU, CHUNG-SHI
Executed: 2013-07-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Forming Bonding Structures