Assignment of Assignor's Interest

Recorded: 2013-08-06 Pages: 4

Assignors

BOND, ROBERT HENRY

Executed: 2010-03-04

KRAMER, ALAN

Executed: 2010-03-04

GOZZINI, GIOVANNI

Executed: 2010-03-04

Assignee

UPEK, INC.

5900 CHRISTIE AVE., EMERYVILLE, CALIFORNIA, 94608

Covered Property (1)

Integrally Molded Die and Bezel Structure for Fingerprint Sensors and the Like

Patent: 8,772,884 →

Application: 13/960,405 →

Publication: US 2013/0320464

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.