IP Library Assignment 030952/0528
Patent Assignment
Reel/Frame 030952/0528

Assignment of Assignor's Interest

Recorded: 2013-08-06 Pages: 8
Assignor
UPEK, INC.
Executed: 2013-01-30
Assignee
AUTHENTEC, INC.
100 RIALTO PLACE, STE. 100, MELBOURNE, FLORIDA, 32901
Covered Property (1)
Integrally Molded Die and Bezel Structure for Fingerprint Sensors and the Like
Patent: 8,772,884 →
Application: 13/960,405 →
Publication: US 2013/0320464
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2013
From: BOND, ROBERT HENRY; KRAMER, ALAN; GOZZINI, GIOVANNI
To: UPEK, INC.
Reel/Frame 030952/0447 →
Assignment of Assignor's Interest May 22, 2014
From: AUTHENTEC, INC
To: APPLE INC.
Reel/Frame 032944/0878 →