Patent Assignment
Reel/Frame 030981/0430
Assignment of Assignor's Interest
Recorded: 2013-08-09
Pages: 3
Assignors
HUANG, XIN-HUA
Executed: 2013-07-15
CHEN, XIAOMENG
Executed: 2013-08-05
LIU, PING-YIN
Executed: 2013-07-15
CHAO, LAN-LIN
Executed: 2013-07-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Alignment Systems and Wafer Bonding Systems and Methods