Patent Assignment
Reel/Frame 031003/0717
Corrective Assignment to Correct the Spelling of Inventor Min-Ta Lei Needs to Be Corrected to Ming-Ta Lei Previously Recorded on Reel 030764 Frame 0930. Assignor(S) Hereby Confirms the Assignment of Assignors Interest.
Recorded: 2013-08-12
Pages: 6
Assignor
LEI, MING-TA
Executed: 2001-04-09
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC, TAIWAN
Covered Property
(1)
A Structure and Manufacturing Method of a Chip Scale Package with Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 10, 2013
From: LIN, MOU-SHIUNG; LEI, MIN-TA; LIN, CHUEN-JYE
To: MEGIC CORPORATION
Reel/Frame 030764/0930 →
Assignment of Assignor's Interest
Jul 10, 2013
From: MEGICA CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030770/0876 →
Corrective Assignment to Correct the Conveying Party Name Needs to Change from Megica to Megic Previously Recorded on Reel 030770 Frame 0876. Assignor(S) Hereby Confirms the Megic Corporation to Megica Corporation.
Aug 9, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030997/0336 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →